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E-Bond 560 Low-Mod Gel -2 gallon kit

E-Bond 560 Low-Mod Gel -2 gallon kit


E-BOND 560 LOW-MOD is a 100% solids, solvent-free, two-component MOISTURE INSENSITIVE epoxy resin system. Has unique LOW-MODULUS OF ELASTICITY, which allows for variations in stress and temperature. With proper aggregate loading, it provides an epoxy mortar/concrete with a co-efficient of expansion very close to Portland-cement concrete. 560 Low- Mod Gel produces a gel-like consistency as a gap filling material for bonding irregular materials, concrete, wood, steel, etc. 560 Gel is also recommended to grout anchor bolts and set dowels. Mixed with salt-free, kiln-dried silica aggregate to produce a sag resistant mortar for overhead and vertical patching.


E-BOND 560 LOW-MOD conforms to ASTM-C-881, Type III, Grade 3, Class B and C, AASHTO-M235-91



  • Easy mixing ratio of 1 to 1 for the two components

  • Gel-like consistency

  • Insensitive to moisture before, during and after cure

  • Exterior epoxy mortar/concrete repair to resist thermal movement

  • Provides excellent adhesion to most structural materials

  • Fast setting; provides high early strength within 24 hours

  • Low Temperature cures as low as 40°F(4oC)

  • Zero VOC - Fully reactive, No low boiling constituents



1 gal E-Bond 560 Part A

1 gal E-Bond 560 Part B


Click Here for 560 Data Sheet

Click Here for MSDS 560A

Click Here for MSDS 560B



For large project/quantity purchases please contact E-Bond for large quantity quote of material.

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