E-Bond 560 Low-Mod Gel -2 gallon kit
E-BOND 560 LOW-MOD is a 100% solids, solvent-free, two-component MOISTURE INSENSITIVE epoxy resin system. Has unique LOW-MODULUS OF ELASTICITY, which allows for variations in stress and temperature. With proper aggregate loading, it provides an epoxy mortar/concrete with a co-efficient of expansion very close to Portland-cement concrete. 560 Low- Mod Gel produces a gel-like consistency as a gap filling material for bonding irregular materials, concrete, wood, steel, etc. 560 Gel is also recommended to grout anchor bolts and set dowels. Mixed with salt-free, kiln-dried silica aggregate to produce a sag resistant mortar for overhead and vertical patching.
E-BOND 560 LOW-MOD conforms to ASTM-C-881, Type III, Grade 3, Class B and C, AASHTO-M235-91
Easy mixing ratio of 1 to 1 for the two components
Insensitive to moisture before, during and after cure
Exterior epoxy mortar/concrete repair to resist thermal movement
Provides excellent adhesion to most structural materials
Fast setting; provides high early strength within 24 hours
Low Temperature cures as low as 40°F(4oC)
Zero VOC - Fully reactive, No low boiling constituents
1 gal E-Bond 560 Part A
1 gal E-Bond 560 Part B
For large project/quantity purchases please contact E-Bond for large quantity quote of material.